X-Ray Imaging

Bond wires in
stacked Si chips

Balls and bumps
of fcBGA

Real-time x-ray imaging is done in transmission and the image can be captured using film or an x-ray imaging system. The sample may be rotated to allow various perspectives, within the limitations of the sample size and geometry.

X-ray imaging is a quick, non-destructive analysis technique to look at solder joint quality and the large scale structure of devices.

Typical applications

• Failure analysis
• Reverse engineering
• Reliability analysis
• Forensic analysis

Detection of:

• Defects and voids in BGA balls, QFNs
• Wire bonding defects
• Metallization burnout
• Voids in through hole pins.

Evaluation of:

• Die attach integrity
• Solder bump quality

Equipment

• 100kV x-ray imaging system upgraded to 1024x1024 pixel CMOS sensor
• X-ray on film for military applications
• 3D x-ray using a 5DX instrument available by special request

If defects are detected, recommendations are made for further tests or analyses.