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X-Ray Imaging

Bond wires in stacked Si chips - Balls and bumps of fcBGA
Bond wires in
stacked Si chips
Balls and bumps
of fcBGA

Real-time x-ray imaging is done in transmission and the image can be captured using film or an x-ray imaging system. The sample may be rotated to allow various perspectives, within the limitations of the sample size and geometry.

X-ray imaging is a quick, non-destructive analysis technique to look at solder joint quality and the large scale structure of devices.

Typical applications

Detection of:

Evaluation of:

Equipment

If defects are detected, recommendations are made for further tests or analyses.

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