Temperature Cycling & Temperature Shock

Temperature cycling and temperature shock are used to determine the resistance of parts to sudden exposure to extreme changes of temperature. Electrical measurements can be done while parts are held at low or high temperature to evaluate the effect of temperature on circuit performance.

Alternating high and low temperature extremes induces mechanical stresses in electronic components and/or solder joints.

Dual chamber air-to-air cycling

Typical applications

Reliability testing according to:

• MIL-STD-883
• MIL-STD-750
• Jedec JESD22-A104-B
• Jedec JESD22-A106-A
• Other standards

Pre-assembly verification of electrical specifications at any temperature

Techniques

• Air-to-air shock
• Liquid-to-liquid shock
• Slow temperature cycling
• Reflow oven
• Acoustic microscopy
• Electrical characterization