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Solderability Testing

Module showing poor solder wetting on pads
Module showing poor solder wetting on pads
Although this device is still electrically sound, it has been damaged by solder heat and shows delamination at the wire bonds, detectable only by acoustic microscopy
Although this device is still electrically sound, it has been damaged by solder heat and shows delamination at the wire bonds, detectable only by acoustic microscopy
Good wetting on pins
Good wetting on pins

The solderability test evaluates the ability of electronic component's terminations to be wetted and to produce a suitable fillet when coated in tin-lead eutectic or lead-free solder.

This resistance to soldering heat test is intended to confirm that semiconductor components are capable of withstanding the elevated temperatures and thermal shocks associated with hot solder attachment.

Steam aging is an optional preconditioning step which degrades the termination finish in order to provide a guard band against marginal finishes or to simulate package storage.

These procedures will test whether the packaging materials and processes used during the manufacturing operation produce a component that can be successfully joined to another surface using lead (Pb) containing or Pb-free solder for the attachment.

Typical applications

Equipment

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