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Shear Test, Bend Test and Tensile Test

Shear testing and pull testing are parts of Destructive Physical Analysis (DPA) for passive or active electronic components and cable assemblies. They evaluate the strength of solder joints or leads against tugging or pushing. Pull tests are done in tension and shear tests in compression. Other materials such as paper, plastic films and metal wire are submitted to tensile tests to verify their elasticity. Bend tests are performed on printed circuit boards to assess the resistance of capacitors to cracking.

 

Typical applications

   

Sample after capacitor shear test showing absence of solder on most of the pad.  

 

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