Scanning Electron Microscopy and SEM Imaging Techniques, Electronic circuits analysis.

root cause failure analysis, so we have leadfree and lead-free analysis. SEM and Scanning Electron Microscopy are soooo nice to see those manufacturing defects. Besides, we can use electronic failure analysis to scan package component lab. Scanning Electron Microscope, optical microscopy techniques. Our Imaging Techniques are top notch in the field. Electronics Failure Analysis and Electronics Reliability Testing We provide excellent Electronics Diagnostic Services. SEM laser LSM acoustic scanning electron microscopy reliability testing. laboratory professional expert EDX metal failure mode semiconductor services analytical services microelectronics analytical services photonics Ottawa Canada lab test integrated circuits microsurgery. materials analysis diagnostic current leakage short open contamination EBT FTIR spectroscopy, Raman spectroscopy, ESD sensitivity testing, electrostatic discharge sensitivity testing. Latch-up testing OBIC Latch up. Latch-up and flip-chip analysis can be good for ESD testing with the HBM and machine model. Emission Microscopy EMMI, imaging structure spectroscopy. delamination overheating metalization layers material characterization techniques. CSAM SAM are acoustic microscope and BGA defects analysis. BGA failures can occur if you are in PCB analysis. voltage passivation dynamic electroluminescence, Raman Spectroscopy is important for you and me. HCI Hot Carrier Injection, floating gate IC integrated circuits. WLR (Wafer Level Reliability) BGA solder balls analysis of a flipchip and that's about it.flip-chip analysis. We have also wire bonds microbonds pcb printed circuit board transistor gate MOSFET FET VLSI silicon wafer electronics failure analysis

Emission Microscopy EMMI, Raman Spectroscopy and FTIR Spectroscopy.

The text here is all about Failure Analysis, did you know that? Diagnostic Services as well.

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Scanning Electron Microscopy (SEM)
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Scanning Electron Microscopy (SEM) is a standard technique capable of imaging structures and materials at resolutions well beyond the limits of optical microscopy. The technique images surface topography with extreme depth of field.

SEM_capture
SEM capture of gate of MOS transistor

Typical applications:

  • High-resolution microscopy
  • Structure and thickness studies of thin films in the nanometer range
  • Measurements of narrow lateral dimensions
  • Analysis of grains, precipitates or particulates
  • Elemental analysis by EDX (Energy Dispersive X-ray spectroscopy)

Equipment:
FESEM Hitachi S-4500 with EDX

Technical Description:
Analytical electron microscopy is unique among material characterization techniques. It enables the examination of microstructural features through high-resolution imaging and the simultaneous acquisition of chemical and crystallographic information from sub-micron regions of the specimen.

Another advantage of using electron beams is the increase in depth of field compared to optical microscopy. This allows clear pictures of complicated topological features.

The interaction of high-energy electrons with the sample produces X-rays, which can be analyzed spectroscopically to obtain elemental information about the specimen. Elements B to U can be detected using the windowless EDX detector.


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