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MAJIC (MuAnalysis Joint Integrity Characterization)
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A comprehensive report describing quality of the soldering process on your finished product.

RoHS Lead-Free Solder Joint Integrity Characterization

Technical description:

  • Initial inspection
    • Visual inspection to IPC-A-610D standard
    • XRAY of BGAs
      • To identify voids or malformed balls
    • Acoustic microscopy of semiconductor components
      • To detect pop-corning or delamination
  • *Stress tests
    • Temperature cycling
    • Shock
    • Vibration
      • To reveal flaws
  • Cross sections of various types of components
    • Intermetallic formation
    • Micro cracks
    • Voiding
      • Written report

      Applications:

      • Use MAJIC as a Procurement Specification to evaluate suppliers
      • Use MAJIC as a Quality Document for your own process


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