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Scanning Acoustic
Microscopy
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Scanning Acoustic
Microscopy (SAM) is a quick, non-destructive analysis technique
that uses ultrasound waves to detect changes in acoustic impedances
in integrated circuits (ICs) and other similar materials. Pulses
of different frequencies are used to penetrate various materials
to examine sample interiors for voids or delamination. MuAnalysis
performs C-mode SAM (or C-SAM), with both reflective and through-scan
capability.
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| SAM image
of integrated circuit showing die attach failure around the
die periphery. |
Typical applications:
Evaluation of:
- Die attach integrity
- Heat spreader
adhesion
- Solder bump
quality
Detection of:
- Die surface
delamination
- Metallization
burnout
Equipment:
Sonoscan D-6000
with through-scan capability
Transducers: 10, 15, 20, 30, 50, 100, 230 MHz
Technical Description:
Assessing package
reliability often requires the ability to study package interiors
without destroying the packages. Scanning Acoustic Microscopy allows
the user to examine different interfaces and determine the mechanical
integrity of the assembly, all non-destructively.
Scanning acoustic microscopy probes with ultrasound pulses at various
frequencies. At interfaces between materials having different acoustic
impedances, an acoustic reflection (an echo) occurs. The intensity
of this echo is recorded and presented as a colour map of the sample.
MuAnalysis uses
a wide range of transducer frequencies, providing the flexibility
to look at various materials and sites. Low frequency transducers,
such as 10, 15, 20 and 30 MHz, allow for higher penetration through
materials but lower spatial resolution. Higher frequency transducers,
such as 50, 100 and 230 MHz, give higher resolution and are used
once an area of concern has been isolated. Reflective microscopy
looks for voiding at a certain interface. Through-scan microscopy
detects voids at any depth in the device.
At MuAnalysis,
on-site physical and failure analysis supports further investigation
if required.
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