Scanning Acoustic Microscopy services and SAM Imaging Techniques, Materials contamination analysis.

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We have Scanning Acoustic Microscopy SAM package analysis packages components electronics laboratory. Now we can do electronics failure analysis microelectronic Reliability testing, and provide diagnostic services. electronics reliability testing SEM laser microscopy LSM, scanning acoustic microscopy electron microscopy. BGA contamination analysis and Raman Spectroscopy are the two most seen manufacturing defects. scanning acoustic microscopy and CSAM electron scanning microscopy is the way for packaging issues and Physical Analysis... Lead-free Leadfree Latch-up Reflow EMMI Emission microscopy Infrared imaging, Thermal imaging, thermal dissipation, improving yields. To make a PCB short or a PCB open circuit and Latch-up analysis and ESD sensitivity testing, acoustic microscopy reliability testing quality control improving yields professional laboratory expert. CSAM SAM EDX Energy Dispersive X-Ray and, integrated circuits X-Ray electronics, X-Ray root cause failure analysis. So you could choose metal failure mode, semiconductor services and/or semiconductors electronics analysis laboratory CSAM. electronic semiconductor analytical services electronics analytical services electronic circuits analysis microelectronics analytical services. photonics services Ottawa Canada defects analysis lab test integrated circuits microsurgery materials analysis optical microscopy techniques. electronic circuits diagnostics current leakage short circuit open circuit semiconductors contamination analysis electronics contamination analysis. EBT so you have Scanning Acoustic Microscopy imaging techniques for your electron beam testing. You would be able to FTIR spectroscopy Raman spectroscopy ESD testing ESD sensitivity Electronics Failure Analysis and Electronics Reliability Testing electrostatic discharges sensitivity. Latch-up testing OBIC Optical beam induced current. Latchup testing Emission Microscopy EMMI imaging techniques are great way to improve yields as well as SAM and Scanning Acoustic Microscope. Our imaging services are also good for structure spectroscopy delamination. integrated circuits overheating metallization layers materials characterization techniques electrical probing. passivation layer and we have both Acoustic Scanning Microscopy and CSAM lying around. dynamic electroluminescence is also good... HCI Hot Carrier Injection floating transistor gate ICs analysis integrated circuits analysis WLR BGA analysis BGA diagnostic solder balls analysis... flip-chip analysis wire bonds testing microbonds pcb diagnostic printed circuit board diagnostic transistor gate, gate oxide. MOSFET, FET and so on... VLSI Silicon wafer contamination silicon wafer analysis spectroscopy laboratory, spectroscopy services. Microanalysis Physical analysis floating gate in the field of Microelectronics failure analysis You could afford to do Scanning Acoustic Microscope as well as Microelectronic failure analysis. Electronic failure analysis Electronic material(s) analysis Electronic process analysis Failure analysis lab Microelectronics lab. ICs printed circuit board.

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Scanning Acoustic Microscopy
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Scanning Acoustic Microscopy (SAM) is a quick, non-destructive analysis technique that uses ultrasound waves to detect changes in acoustic impedances in integrated circuits (ICs) and other similar materials. Pulses of different frequencies are used to penetrate various materials to examine sample interiors for voids or delamination. MuAnalysis performs C-mode SAM (or C-SAM), with both reflective and through-scan capability.

SAM image of integrated circuit showing die attach failure around the die periphery.

Typical applications:

Evaluation of:

  • Die attach integrity
  • Heat spreader adhesion
  • Solder bump quality

Detection of:

  • Die surface delamination
  • Metallization burnout

Equipment:
Sonoscan D-6000 with through-scan capability
Transducers: 10, 15, 20, 30, 50, 100, 230 MHz

Technical Description:
Assessing package reliability often requires the ability to study package interiors without destroying the packages. Scanning Acoustic Microscopy allows the user to examine different interfaces and determine the mechanical integrity of the assembly, all non-destructively.

Scanning acoustic microscopy probes with ultrasound pulses at various frequencies. At interfaces between materials having different acoustic impedances, an acoustic reflection (an echo) occurs. The intensity of this echo is recorded and presented as a colour map of the sample.

MuAnalysis uses a wide range of transducer frequencies, providing the flexibility to look at various materials and sites. Low frequency transducers, such as 10, 15, 20 and 30 MHz, allow for higher penetration through materials but lower spatial resolution. Higher frequency transducers, such as 50, 100 and 230 MHz, give higher resolution and are used once an area of concern has been isolated. Reflective microscopy looks for voiding at a certain interface. Through-scan microscopy detects voids at any depth in the device.

At MuAnalysis, on-site physical and failure analysis supports further investigation if required.


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