Teardown Analysis

When you have to know what makes it tick.

Teardown analysis comprises a set of techniques for examining devices and materials at the smallest constituent level. The result is a comprehensive report presenting our thorough analysis of the construction and materials of a device as examined from all angles. At MuAnalysis we also routinely acquire and tear down interesting new products, then offer reports of our findings which can be found in our publications section.

A highly dislocated GaN substrate, revealed by a decorative etch, contributes to patchiness in light emission

Typical applications

• Root-cause Failure Analysis
• Technology evaluation
• Supplier qualification
• Quality documentation
• Non-conformance verification
• Reliability qualification
• Technology cloning
• Destructive Physical Analysis (DPA) per MIL-STD-750
• Intellectual property violation
• Counterfeit detection

Equipment and Techniques

A wide range of sophisticated analytical techniques is used to examine materials and devices including:

• Acoustic microscopy
• X-Ray imaging
• Scanning Electron Microscopy (SEM)
• Energy Dispersive X-Ray (EDX)
• X-Ray Fluorescence Spectroscopy
• Raman spectroscopy
• FTIR spectroscopy
• UV fluorescence microscopy
• Confocal Laser Scanning Microscopy (CLSM)
• Optical Beam Induced Current (OBIC)
• Emission Microscopy (EMMI)
• Optical microscopy
• BGA layer by layer analysis
• Environmental chamber stressing