Lead-Free Analysis

Lead free components need to be reflowed at higher temperature than their leaded counterparts. The additional thermal budget implies a degradation of the moisture sensitivity level of devices often by one or more level. As well, the higher temperatures and altered metallurgies can lead to the formation of brittle intermetallics or other effects, such as whiskers, whose long term reliability implications need to be understood. The expert analysts at MuAnalysis are there to help you get your product to market on time.

"Member States shall ensure that, from 1 July 2006, new electrical and electronic equipment put on the market does not contain lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE). National measures restricting or prohibiting the use of these substances in electrical and electronic equipment which were adopted in line with Community legislation before the adoption of this Directive may be maintained until 1 July 2006."

Optical and electron microscope images of voids in
lead- free balls after reflow

Typical applications

• Reliability testing
• Qualification
• Supplier evaluation
• Engineering and R&D
• RoHS compliance
• Solder joint integrity
• Moisture Sensitivity Level (MSL)

Equipment

An extensive range of lab equipment and techniques enables our experienced analysts to perform stress tests and analyse materials and devices.

• High temperature ovens (RT to 250C, RT to 350C)
• Temperature-humidity chamber
• Reflow station (as seen here)
• HAST
• Autoclave
• Temperature cycling (-65 to +200C)
• Steam aging
• Solderability testing
• Acoustic microscope
• Electron microscope with EDX
• X-Ray Fluorescence (XRF) spectroscope
• X-Ray