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BGA Layer by Layer Construction Analysis

Cross-section showing core and blind via
Cross-section showing core and blind via
Internal layer of BGA package
Internal layer of BGA package
EDX spectrum of intermetallic formation
EDX spectrum of intermetallic formation

Measurements of critical dimensions  on internal layer.
Measurements of critical dimensions on internal laye

Construction Analysis documents the critical parameters of the materials within a device in order to verify specifications. Cross-sections of devices are performed at specific locations to document layer stack-up, via construction, and material composition. Some devices are delayered to reveal the structure of internal layers. All lines and spaces are measured.

Typical Applications

Techniques

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