BGA Layer by Layer Construction Analysis

Cross-section showing core and blind via

Internal layer of BGA package

EDX spectrum of intermetallic formation

Measurements of critical dimensions on internal laye

Construction Analysis documents the critical parameters of the materials within a device in order to verify specifications. Cross-sections of devices are performed at specific locations to document layer stack-up, via construction, and material composition. Some devices are delayered to reveal the structure of internal layers. All lines and spaces are measured.

Typical Applications

• Quality documentation
• Supplier evaluation
• Non-conformance verification
• Failure analysis
• Reliability qualification
• Technology cloning
• Destructive Physical Analysis (DPA)
• Intellectual property violation
• Counterfeit detection

Techniques

• X-Ray imaging
• Acoustic microscopy
• Electron microscopy with EDX
• X-Ray Fluorescence (XRF) spectroscopy
• Raman spectroscopy
• FTIR spectroscopy
• Confocal Laser Scanning Microscopy (CLSM)