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MuAnalysis Technical Capabilities
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BGA layer-by-layer Construction Analysis
Counterfeit Detection & Materials Verification
Decapsulation & Repackaging of ICs
Disjointment & RoHS Screening
Dynamic Electroluminescence Imaging (DEI)
Electron Beam Testing (EBT)
Emission Microscopy (EMMI)
Optical Beam Induced Current (OBIC)
ESD & Latch-up Analysis
Failure Analysis Services
FTIR Micro-spectroscopy
Liquid Crystal & Fluorescent Microthermal Imaging (FMI)
Laser Scanning Microscopy (LSM)
Lead-free Analysis
MuAnalysis Joint Integrity Characterization (MAJIC)
Process, Package & Product Qualification
Raman Micro-spectroscopy
Reliability Testing & Reliability Analysis
Scanning Acoustic Microscopy
Scanning Electron Microscopy (SEM)
Solderability Resistance to Soldering Heat
Teardown Reports
Temperature cycling & temperature shock
X-Ray Imaging
MuAnalysis Microelectronics Overview in Mandarin
(270K PDF)
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