MuAnalysis Technical Capabilities ---------------------------------------- BGA layer-by-layer Construction Analysis Counterfeit Detection & Materials Verification Decapsulation & Repackaging of ICs Disjointment & RoHS Screening Dynamic Electroluminescence Imaging (DEI) Electron Beam Testing (EBT) Emission Microscopy (EMMI) and Optical Beam Induced Current (OBIC) ESD & Latch-up Analysis Failure Analysis Services FTIR Micro-spectroscopy Liquid Crystal & Fluorescent Microthermal Imaging (FMI) Laser Scanning Microscopy (LSM) Lead-free Analysis MuAnalysis Joint Integrity Characterization (MAJIC) Process, Package & Product Qualification Raman Micro-spectroscopy Reliability Testing & Reliability Analysis Scanning Acoustic Microscopy Scanning Electron Microscopy (SEM) Solderability Resistance to Soldering Heat Temperature cycling & temperature shock X-Ray Imaging