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Printed Circuit Board Reliability and Integrity Characterization Using MAJIC

Abstract
The recent need to develop lead-free electrical and electronic products has resulted in an increased demand to characterize solder joint integrity. Many standards exist to evaluate the long term reliability of electronic components or the quality of an assembly process. However no standards apply to custom printed circuit board assemblies. For example, the IPC-9701 standard and the use of evaluation boards are intended at evaluating processes as opposed to products. We have devised a methodology, combining inspection, the application of thermal and mechanical fatigue to stress the solder joints and the devices, and cross-section analysis to evaluate the quality of the solder joints, plated through-holes, and board manufacturing. This test, which we have named MAJIC (MuAnalysis Joint Integrity Characterization), has been applied to printed circuit boards of various finishes that have been assembled using leaded or unleaded solder pastes and using both leaded and unleaded components in various combinations.

The MAJIC methodology provides a vehicle to qualify an assembly process or to evaluate a supplier. With the addition of predetermined quantitative criteria, it could become a standard for the qualification of custom printed circuit board assemblies. This paper will demonstrate the wealth of information and reliability risks that have been exposed using this methodology on several products.




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