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Printed Circuit Board Reliability and Integrity Characterization Using MAJIC
Abstract
The recent need to develop lead-free electrical and electronic products has resulted in an increased demand to characterize
solder joint integrity. Many standards exist to evaluate the long term reliability of electronic components or the quality of an
assembly process. However no standards apply to custom printed circuit board assemblies. For example, the IPC-9701
standard and the use of evaluation boards are intended at evaluating processes as opposed to products. We have devised a
methodology, combining inspection, the application of thermal and mechanical fatigue to stress the solder joints and the
devices, and cross-section analysis to evaluate the quality of the solder joints, plated through-holes, and board manufacturing.
This test, which we have named MAJIC (MuAnalysis Joint Integrity Characterization), has been applied to printed circuit
boards of various finishes that have been assembled using leaded or unleaded solder pastes and using both leaded and
unleaded components in various combinations.
The MAJIC methodology provides a vehicle to qualify an assembly process or to evaluate a supplier. With the addition of
predetermined quantitative criteria, it could become a standard for the qualification of custom printed circuit board
assemblies. This paper will demonstrate the wealth of information and reliability risks that have been exposed using this
methodology on several products.
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Lumileds Luxeon K2 LED Lamp Teardown Report-short version
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We present the results of a teardown and technology analysis of the now common multi-colour strings of LED’s sold as
Christmas lights. Interesting findings are reported and demonstrations of some advanced analysis techniques are illustrated.
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